congatec Launches Power-Efficient COM Express Basic Module

The new small form factor (95 x 125 mm) conga-BS57 provides maximum computing power and graphics performance with lower power consumption

San Diego, CA ***(July 06, 2010) * * * congatec AG expands its COM Express product family with its latest high performance module, the conga-BS57. Featuring the latest Intel® low-power processors in a small form factor (SFF) package soldered onto the BGA, it is particularly suitable for shock resistant applications such as automation and transportation…...

Depending on the application, the conga-BS57 taps into a wide a range of processors beginning with the Intel® Celeron® U3400 processor (4MB Cache, 1.06 GHz, TDP 18 Watt) up to the Intel® Core™ i7-620 LE processor (4MB Cache, 2.0 GHz, TDP 25 Watt).

The conga-BS57 features the Mobile Intel® HM55 Express Chipset which measures only 25 x 27 mm and provides a powerful, compact two-chip solution with up to 8GB (1066 MT/s) dual channel DDR3 memory.

The integrated graphics controller supports the Intel ® Flexible Display Interface (FDI) thereby enabling two independent video channels on VGA, LVDS, HDMI, display port and SDVO interfaces.

Because it uses energy-efficient processors, the COM Express basic module with type 2 pin-out provides particularly high graphics performance. Compared to previous generations of Intel integrated graphics, 3-D performance has been significantly improved. Coupled with the additional computing power of the Intel® Core™ i7 processor, the conga-BS57 is an ideal solution for low-power, graphics-intensive applications such as those often found in the gaming market or in medical imaging systems.

The integrated Intel® Turbo Boost Technology can over clock a processor core if the second core operates at low capacity. congatec benchmark tests have shown that it is possible to boost the computational power of a processor core by up to 25% when using this technology.

To keep power consumption at about the same level as earlier processor generations, the Intel® Core™ i7 processor supports the latest low-power modes. Due to deployment of the  Intel® Core™ C6 state, where the processor status is stored in a dedicated SRAM, the cores can be switched off, reducing power consumption to almost zero. Because the individual cores can assume C6 status independently of one another, power efficiency is increased.

Five PCI express lanes, eight USB 2.0 ports, three SATA, EIDE and one interface enable flexible system extensions at high data bandwidths. A fan controller, an LPC bus for slower expansions, as well as Intel® High Definition Audio, round off the feature set.

Price and Availability
Samples of the conga-BS57 are available now at a volume price starting below $500.00.

About congatec AG

congatec AG has its head office in Deggendorf, Germany. It is an innovative business that specializes in the development and marketing of industrial computer modules using the standard form factors Qseven, COM Express, XTX and ETX. With this focus and annual revenue of 26 million euros (2009), congatec is today a leading manufacturer in this field. The company’s products can be used in a variety of industries and applications, such as industrial automation, medical technology, automotive supplies, aerospace and transportation. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. congatec currently has 80 employees and has branch offices in Plzeň and Brno/Czech Republic, Taipei/Taiwan and San Diego/USA. More information is available on our website at www.congatec.us

Intel and Intel Core are registered trademarks of the Intel Corporation in the USA and in other countries

congatec is an Associate Member with the Intel® Embedded Alliance, a community of communications and embedded developers and solution providers. For more information, please visit www.intel.com/go/eca

Congatec
6262 Ferris Square
San Diego, CA, 92121
USA

tele: 858-457-2600 x 304
fax: 858-457-2602
sales-us@congatec.com
www.congatec.us