Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems


The XPedite7450 is a rugged COM Express® module that complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. It is available with the quad-core Core i7-3612QE or dual-core Core i7-2655LE, Core i7-2610UE, Core i7-3555LE, or Core i7-3517UE processors. The XPedite7450 features up to 16 GB of DDR3-1333/DRR3-1600 ECC SDRAM, an integrated high-performance 3D graphics controller, five Gen2 PCI Express ports, four USB 2.0 high-speed ports, six SATA 3.0 Gb/s ports, and an Intel High Definition Audio port. BSPs for Linux, INTEGRITY, and VxWorks and Windows drivers are available.

Features & Benefits
Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite7450 is a rugged, reliable COTS processor mezzanine solution with enhancements above and beyond commercial COM Express modules.

  • Incorporates the same design and manufacturing principles as all X-ES Level 5 rugged products
  • Designed and tested for operation from -40 to +85şC
  • Replaces less rugged/reliable SO-DIMMs with soldered-down memory
  • Includes additional mounting holes for increased structural integrity
  • Provides extended shock and vibration capabilities for operation in harsh environments
  • Supports conduction-cooled and air-cooled applications with a single board design
  • Utilizes tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)
  • Provides BIT support


3225 Deming Way, Suite 120
Middleton, WI, 53562

tele: 608-833-1155
fax: 608-827-6171