Intel Developer Forum 2009 Exhibitor Profiles

Intel Developer Forum 2009, San Francisco

SAN FRANCISCO--(BUSINESS WIRE)--Intel Developer Forum 2009 takes place September 22-24, 2009 at Moscone West in San Francisco. Intel Developer Forum 2009 breaking news releases, advisories, photos, and multimedia are available at, Business Wire's trade show, conference, and event news resource. Listed below are Intel Developer Forum 2009 exhibitor profiles. Company: HP Booth: 302 Ticker Symbol & Exchange: NYSE: HPQ Media Contact: Jim Christensen Phone: 408.309.0186 E-mail: Web: HP, the worlds largest technology company, simplifies the technology experience for consumers and businesses with a portfolio that spans printing, personal computing, software, services and IT infrastructure. More information about HP (NYSE: HPQ) is available at Company: Rambus Booth: 101 Ticker Symbol & Exchange: RMBS Media Contact: Linda Ashmore Phone: (650) 947-5411 E-mail: Web: For nearly 20 years, Rambus has been specializing in the design of high-speed memory architectures. Rambus offers the broadest range of low-risk, silicon-proven memory interfaces, innovations and patented inventions for cost-efficient and low-power designs that improve overall system performance. Today, Rambus interface solutions enable state-of-the-art performance in computing, graphics, mobile, and consumer electronics applications. Visit Rambus at Booth No. 101 to view Rambus XDR DRAM Product Showcase featuring a complete line-up of products available with the award-winning XDR memory architecture. Additional information is available at Follow us on Twitter @Rambusinc. Company: SNRLabs Corp. Media Contact: Carol Brighton Phone: 972 693 7236 E-mail: Web: SNRLabs is a young communications software company that develops technology to improve user experience in converged mobile devices such as smartphones, tablets, MID-s, and netbooks with respect to mobile connectivity. SNRLabs offers complete system-level solutions on mobile devices to quickly assess and efficiently manage multiple radios to provide seamless connectivity at longer battery life. The company is headquartered in Richardson, Texas and also has offices in Taiwan and India. The company is announcing its Advanced Connection Management Suite software, soon to be available to end-users on Intels next-generation handheld platforms.